The Precision Revolution in semiconductor manufacturing: When granite meets micron technology
1.1 Unexpected discoveries in materials science
According to the 2023 SEMI International Semiconductor Association report, 63% of the world's advanced fabs have begun to use granite bases instead of traditional metal platforms. This natural stone, which originates from magma condensation deep in the Earth, is rewriting the history of semiconductor manufacturing because of its unique physical properties:
Thermal inertia advantage: the thermal expansion coefficient of granite 4.5×10⁻⁶/℃ is only 1/5 of that of stainless steel, and the dimensional stability of ±0.001mm is maintained in the continuous work of the lithography machine
Vibration damping characteristics: the internal friction coefficient is 15 times higher than that of cast iron, effectively absorbing equipment micro-vibration
Zero magnetization nature: completely eliminate the magnetic error in laser measurement
1.2 The metamorphosis journey from mine to fab
Taking ZHHIMG's intelligent production base in Shandong as an example, a piece of raw granite needs to undergo:
Ultra-precision machining: five-axis linkage machining center for 200 hours of continuous milling, surface roughness up to Ra0.008μm
Artificial aging treatment: 48 hours of natural stress release in the constant temperature and humidity workshop, which improves the stability of the product by 40%
Second, crack the six precision problems of semiconductor manufacturing "rock solution"
2.1 Wafer fragmentation rate reduction scheme
Case demonstration: After a chip foundry in Germany adopts our gas floating granite platform:
|
Wafer diameter |
chip rate reduction |
flatness improvement |
|
12 inches |
67% |
≤0.001mm |
|
18 inches |
82% |
≤0.0005mm |
2.2 Lithographic alignment accuracy breakthrough scheme
Temperature compensation system: embedded ceramic sensor monitors the shape variable in real time and automatically adjusts the platform inclination
Measured data: under the fluctuation of 28℃±5℃, the embedding accuracy fluctuates less than 0.12μm
Post time: Mar-24-2025