Granite is an excellent material for machine bases, especially for wafer processing equipment, because of its unique properties such as high stiffness, low thermal expansion, and superior vibration damping characteristics. While metal has been traditionally used as a material for machine bases, granite has emerged as a superior alternative due to the following reasons:
High stiffness: A machine base needs to be rigid and stable to minimize vibrations and maintain accuracy during wafer processing. Granite has a high stiffness-to-weight ratio, which makes it extremely rigid and stable, thereby reducing vibrations and ensuring excellent machining accuracy.
Low thermal expansion: Temperature changes can cause metal to expand or contract, resulting in dimensional changes in the machine base and leading to inaccuracies in processing. Granite, on the other hand, has a low coefficient of thermal expansion, which means that it does not expand or contract much with temperature changes, ensuring stability and accuracy in processing.
Superior vibration damping: Vibration is a common issue in machine tools, and it can lead to dimensional errors, surface finish issues, and even premature wear and tear of the machine components. Granite is known for its excellent vibration damping properties, which means that it can absorb and dampen vibrations, ensuring smooth and accurate processing.
Chemical resistance: Wafer processing involves the use of various chemicals, and exposure to these chemicals can cause corrosion and degradation of the machine base over time. Granite is highly resistant to chemical corrosion, making it a safe and durable material choice for machine bases in wafer processing equipment.
Low maintenance: Granite requires minimal maintenance, is easy to clean, and does not corrode or rust like metal. This translates to lower maintenance costs and less downtime for the equipment.
Overall, choosing granite over metal for a machine base for wafer processing equipment offers several advantages, including high stiffness, low thermal expansion, superior vibration damping, excellent chemical resistance, and low maintenance. These benefits ensure that the machine base remains stable, accurate, and durable, resulting in high-quality wafer processing and increased productivity.
Post time: Dec-28-2023